Copper Clad Plate

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Copper Clad Plate Specification

  • Thickness: Total thickness: 5-50mm (cladding material thickness: 1-10mm)
  • Sizes: 300 mm x 300 mm（12” x 12”）、600 mm x 600 mm（24” x 24”）、1000 mm x 1000 mm（39.37” x 39.37”), etc.
  • Surface treatment No.1 or as per your requirements
  • Base Material: FR-4, CEM-1/CEM-3, PTFE, PI, etc.
  • Composite Process: Laser Etching, Transfer Lamination, Chemical Plating, Spraying, Electroplating, Lamination
  • Manufacturing standard: IPC-6012, IPC-2221, IPC-4101, IPC-4562, JIS C 6480, JIS C 6108, UL 94, UL 796, MIL-PRF-55110, MIL-PRF-31032, EN 60684, ASTM D257, ASTM E84
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Features of Copper Clad Sheet

  1. Excellent Electrical Conductivity: Copper clad sheets provide outstanding electrical conductivity, making them ideal for use in printed circuit boards (PCBs) and other electronic components where efficient electrical signal transmission is crucial.

  2. High Thermal Conductivity: They possess superior thermal conductivity, allowing them to dissipate heat efficiently. This is essential for applications such as heat sinks and thermal management in electronic devices.

  3. Durability and Strength: The copper layer is bonded to a substrate (often fiberglass or other composite materials), which provides mechanical strength and durability. This combination ensures the sheets can withstand physical stress and environmental factors.

  4. Corrosion Resistance: Copper has natural resistance to corrosion, which helps extend the lifespan of the copper-clad sheets, especially in challenging environments.

  5. High Reliability: Copper clad sheets offer consistent performance and reliability, making them suitable for critical applications in aerospace, defense, telecommunications, and medical devices.

  6. Flexibility in Manufacturing: They can be manufactured in various thicknesses, sizes, and configurations to meet specific design requirements. This versatility makes them adaptable for different applications.

  7. Good Adhesion: The copper layer adheres well to the substrate material, ensuring a stable and durable bond that maintains the integrity of the copper-clad sheet over time.

  8. Thermal Expansion Compatibility: Copper and its substrate materials typically have compatible thermal expansion properties, reducing the risk of delamination or warping under temperature fluctuations.

  9. Easy Fabrication: Copper clad sheets are amenable to various fabrication processes, including drilling, etching, and plating, which facilitates the creation of complex circuit patterns and designs.

  10. High-Quality Surface Finish: The copper surface provides a smooth finish ideal for high-precision applications, enhancing the overall performance and aesthetics of the final product.

  11. Environmental and Regulatory Compliance: Many copper clad sheets are manufactured to meet industry standards and regulations, ensuring they are safe and environmentally friendly.

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